CM 74

Capable of grinding standard chamfered edges on multi-crystalline silicon ingots, the CM74 is aimed at high volume manufacture and is a perfect complement for the TS2 Surface Grinding machine in a cellular manufacturing environment. The machine addresses the need for superior surface finish on chamfers by utilising multiple spindles to grind all four chamfers simultaneously thus allowing for a substantially slower linear in feed rate. The CM74 retains the ability to operate within an automated production environment and includes a handling interface for component exchange with a factory automation system.

 

Features

 

Increased Yield

By using four grinding spindles simultaneously, the CM74 is able to grind chamfer edges at a reduced linear feedrate. In addition to this, the use of high frequency spindles combined with ultra fine diamond grinding wheels results in superior surface finish and reduced sub-surface damage thus maximising potential wafer yield.