TS 3
The TS3 continues the development of twin spindle surface grinders for multi-crystalline silicon. The new design addresses the need for side face and chamfer grinding in one machine whilst increasing capacity up to a maximum block length of 400mm. The machine is designed to operate within an automated production environment and includes a handling interface for component exchange with a factory automation system. With this requirement in mind, the machine is self adjusting and is capable of running in a 24hr production environment with minimal operator intervention.
Features
- Side Face and Chamfer Grinding in one process
- Synthetic Granitan base for improved thermal stability for highest dimensional accuracy and surface finish
- Full CNC control system for ultimate machine flexibility
- Integrated Laser measuring system for in-process component inspection
- Dedicated loading system to maximise cutting time
Greater Flexibility
The built in automation within the TS3 grinding machine allows for blocks of differing formats or lengths to be processed without operator intervention. This coupled with the ability to face grind and chamfer in one process offers an extremely flexible surface finishing solution.
Specification
Workpiece Material
Work Process
Maximum Workpiece Dimensions
Minimum Workpiece Dimensions
Machine Dimensions
Machine Weight
Connection Capacity
Voltage/Frequency
Compressed Air Requirement
Coolant
Approximate Capacity
TS 3
Multi Crystalline Silicon
Flat Grinding & Chamfering
210mm x 210mm x 300mm
125mm x 125mm x 150mm
2300mm x 2100mm x 2000mm
Approx. 10000kg
7 kW
400V/50Hz; 480V/60Hz
5-7 bar
Water
70MW
