The TS3Q continues the development of twin spindle surface grinders for multi-crystalline silicon from Abwood Machine Tools. The new design addresses the superior surface finish by combining rough and fine grinding in one process whilst also increasing capacity up to a maximum block length of 400mm. The TS3Q retains the ability to operate within an automated production environment and includes a handling interface for component exchange with a factory automation system.



  • Twin Spindle Design for reduced cycle time
  • Side Face & Chamfer Grinding in one process
  • Synthetic Granitan base for improved thermal stability for highest dimensional accuracy and surface finish
  • Full CNC control system for ultimate machine flexibility
  • Integrated Laser measuring system for in-process component inspection
  • Dedicated loading system to maximise cutting time


Increased Productivity

Vitrified Bonded diamond grinding wheels are successfully used for the side face and chamfer grinding of silicon blocks. The composition of the diamond wheels coupled with the excellent stability and rigidity of the machine result in excellent cutting performance and maximum surface finish of finished components.


Workpiece Material

Work Process

Maximum Workpiece Dimensions

Minimum Workpiece Dimensions

Machine Dimensions

Machine Weight

Connection Capacity


Compressed Air Requirement


Approximate Capacity


Multi Crystalline Silicon

Flat Grinding & Chamfering

210mm x 210mm x 400mm

125mm x 125mm x 150mm

2300mm x 2100mm x 2000mm

Approx. 10000kg

8 kW

400V/50Hz; 480V/60Hz

5-7 bar